250+ TOP MCQs on Digital Integrated Circuits – 2 and Answers

Digital Electronic/Circuits Questions and Answers for experienced on “Digital Integrated Circuits-2”.

1. SSI refers to ___________
A. Small Scale Integration
B. Short Scale Integration
C. Small Set Integration
D. Short Set Integration
Answer: A
Clarification: SSI refers to Small Scale Integration.

2. Small Scale Integration(SSI) refers to ICs with __________ gates on the same chip.
A. Fewer than 10
B. Greater than 10
C. Equal to 10
D. Greater than 50
Answer: A
Clarification: Small Scale Integration(SSI) refers to ICs with fewer than 10 gates on the same chip.

3. MSI means ___________
A. Merged Scale Integration
B. Main Scale Integration
C. Medium Scale Integration
D. Main Set Integration
Answer: C
Clarification: MSI means Medium Scale Integration.

4. MSI includes _______ gates per chip.
A. 12 to 100
B. 13 to 50
C. greater than 10
D. greater than 100
Answer: A
Clarification: Medium Scale Integration includes 12 to 100 gates per chip.

5. LSI means ________ and refers to ________ gates per chip.
A. Long Scale Integration, more than 10 upto 10000
B. Large Scale Integration, more than 100 upto 5000
C. Large Short Integration, less than 10 and greater than 5000
D. Long Short Integration, more than 10 upto 10000
Answer: B
Clarification: The full form of LSI is Large Scale Integration and refers to more than 100 upto 5000 gates per chip.

6. Integrated circuits are classified as ___________
A. Large, Small and Medium
B. Very Large, Small and Linear
C. Linear and Digital
D. Non-Linear and Digital
Answer: C
Clarification: Integrated circuits are classified as Linear and Digital. Linear operates with continuous and digital refers to discrete signals.

7. According to the IC fabrication process logic families can be divided into two broad categories as ___________
A. RTL and TTL
B. HTL and MOS
C. ECL and DTL
D. Bipolar and MOS
Answer: D
Clarification: According to the IC fabrication process logic families can be divided into two broad categories as: Bipolar and Metal-oxide semiconductor. The mentioned all others are part of bipolar. Bipolar IC fabrication refers to TTL logic where MOS refers to CMOS logic.

8. The full form of DIP is ___________
A. Dual-in-Long Package
B. Dual-in-Line Package
C. Double Integrated Package
D. Double-in-Line Package
Answer: B
Clarification: The full form of DIP is Dual-in-Line Package.

9. LCC refers to ___________
A. Longest Chip Carrier
B. Leadless Chip Carrier
C. Leaded Chip Carrier
D. Large Chip Carrier
Answer: B
Clarification: LCC refers to Leadless Chip Carrier.

10. PGA refers to ____________
A. Plastic Grid Array
B. Pin Grid Array
C. Pin Greater Array
D. Plastic Greater Array
Answer: B
Clarification: PGA refers to Pin Grid Array.

for Experienced,